Solvent FreeThermally Conductive
Epoxy Paste Adhesive
DEAL FOR: High Power Die Attach Substrate and Component Reworka bility Mismatched CTE'S
ME7155-M is a flexible, alumina filled, electrically insulating andthermally conductive epoxy paste adhesive which exhibits outstandingflexibility for bonding materials having highly mismatched CTES(I.ealumina to aluminum, silicon to copper). The high thermal conductivityof this material makes it useful for bonding high-powered, large areadie and components.
It can be readily reworked at 80-100℃.
ME7155-M is available in syringes for automatic needle dispenseapplications or in jars.
(1) Remove from freezer in original sealed package.
(2) Thaw for 30 to 60 minutes at 25'C before using.
(3) Dispense adhesive onto clean substrate.
(4) Cure according to one of the recommended cure schedules.
Temperature Time Presure
Pot life is 5 days at 25ºC.
Storage temperature Shelf Life