CoolTherm® SC-3500 thermally conductive, low volatile silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

CoolTherm® UR-389 encapsulant is a two-component urethane system designed for encapsulating and casting applications. CoolTherm UR-389 encapsulant cures at room temperature to produce a flame retardant, semiflexible material.

CoolTherm® SC-324 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.

LORD CoolTherm® SC-305 thermally conductive silicone encapsulant is a two-component system designed for encapsulation applications. It is suited for a variety of electronics applications where high heat dissipation is required. CoolTherm SC-305 encapsulant can be either room temperature cured or heat cured for maximum adhesion.

LORD Thermoset SC-320LVH is a two-component system that not only provides the excellent thermal conductivity required for electronic / electrical packaging, but also retains the necessary silicon-related characteristics.

NoCleanSolderPasteFeatures:-BroadPrintingProcessWindow         -Low-Tombstoning        -NoHead-in-Pillow-ClearPin–ProbeTestableResidue

TSF-WS917-1 is a water-soluble viscous flux. Post-reflow residues are completely soluble in water and can be rinsed off at temperatures as low as 40 ° C without the need to add cleaning additives.

Kester TSF ULR-18 is a no-clean ultra-low residual tack flux. To meet this market demand, Kester has developed an ultra-low resolution viscous flux with a reflow residue weight of less than 10%, which is reduced by 3 times compared with traditional rosin-based viscous flux, and the trace amount of residue is very reliable , Compatible with post-processing materials.

CT2700R7S is a low-temperature, pressure-free sintered silver paste based on nanotechnology with a thermal conductivity of up to 200W and excellent thermal conductivity.

CT2021E is a solvent-free silver glue with low moisture absorption and low stress, suitable for resin systems with low elastic modulus.

CT285LT is a high thermal conductivity silver paste that can be cured at a low temperature, suitable for the mounting of power ICs, transistors and high-power, high-brightness LEDs

XT2884 is an epoxy resin-based transparent insulating adhesive, suitable for bonding small chips such as LEDs.

CT227L is a non-solvent paste based on epoxy resin. The paste has high adhesive strength and is suitable for mounting small chips (such as LED chips).

CT2403 is based on our original new silicone polymer, which has excellent die-cutting strength and good LED heat resistance.

CT285 is a solvent-free silver glue with epoxy resin as the base material. CT285 has excellent electrical conductivity and thermal conductivity, and is suitable for the mounting of power module packages that must have high heat dissipation, and the use of high-power and high-brightness LEDs.

CT220HK-S1 is a solvent-free silver paste based on epoxy resin, suitable for dipping process. It is suitable for the mounting of LEDs with small chips and has excellent reliability.

CoolTherm® SC-3500 thermally conductive, low volatile silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

CoolTherm® UR-389 encapsulant is a two-component urethane system designed for encapsulating and casting applications. CoolTherm UR-389 encapsulant cures at room temperature to produce a flame retardant, semiflexible material.

CoolTherm® SC-324 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.

LORD CoolTherm® SC-305 thermally conductive silicone encapsulant is a two-component system designed for encapsulation applications. It is suited for a variety of electronics applications where high heat dissipation is required. CoolTherm SC-305 encapsulant can be either room temperature cured or heat cured for maximum adhesion.

Kester WP616 is a halogen-free, lead-free, water-soluble solder paste formulation suitable for nitrogen and air reflow applications.

PREFORMDIMENSIONALOFFERINGSKesterpreformsCanbeprocessedinawiderangePleaseviewthetablebelowforstandarddimensionalofferingsandtolerances.

Complete intermetallic bonding Very good metal tightness Excellent mechanical strength, ductility and high reliability Copper cladding makes the solid conductive and thermally better

LORD® 403E and 406E acrylic adhesives are used in conjunction with LORD curing agent 17, 19 or 19GB to replace welding, brazing, riveting and other mechanical fastening methods. These adhesives are particularly excellent in low temperature environments and high impact load applications.

Lord ® 320 / 322 is a two-component general-purpose epoxy adhesive specially used for bonding SMC of automobile molding plastics without surface treatment. For pretreated metal, rubber, glass fiber plastic (FRP), thermosetting polyester, thermoplastic polyester and other materials, the adhesive system has excellent adhesive properties.

LORD Chemlok ?? 459X primer is used to promote adhesion to thermoplastic elastomer (TPE), thermoplastic polyolefin (TPO) and EPDM rubber, and can be applied directly.