
LORD Thermoset SC-315 is a two-component system thermal conductive silicon encapsulant, designed to have excellent flame retardancy and exhibit low shrinkage and stress, providing excellent high temperature resistance for curing systems, continuous working temperature up to 200 ℃.
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Kester TSF ULR-18 is a no-clean ultra-low residual tack flux. To meet this market demand, Kester has developed an ultra-low resolution viscous flux with a reflow residue weight of less than 10%, which is reduced by 3 times compared with traditional rosin-based viscous flux, and the trace amount of residue is very reliable , Compatible with post-processing materials.
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CT285 is a solvent-free silver glue with epoxy resin as the base material. CT285 has excellent electrical conductivity and thermal conductivity, and is suitable for the mounting of power module packages that must have high heat dissipation, and the use of high-power and high-brightness LEDs.
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LORD® 403E and 406E acrylic adhesives are used in conjunction with LORD curing agent 17, 19 or 19GB to replace welding, brazing, riveting and other mechanical fastening methods. These adhesives are particularly excellent in low temperature environments and high impact load applications.
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Lord ® 320 / 322 is a two-component general-purpose epoxy adhesive specially used for bonding SMC of automobile molding plastics without surface treatment. For pretreated metal, rubber, glass fiber plastic (FRP), thermosetting polyester, thermoplastic polyester and other materials, the adhesive system has excellent adhesive properties.
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