LORD Thermoset SC-320LVH is a two-component system that not only provides the excellent thermal conductivity required for electronic / electrical packaging, but also retains the necessary silicon-related characteristics.

LORD Thermoset SC-320 is a two-component system designed to meet the high thermal conductivity requirements in the electrical / electronic packaging field while maintaining the ideal characteristics of silicone.

LORD Thermoset SC-315 is a two-component system thermal conductive silicon encapsulant, designed to have excellent flame retardancy and exhibit low shrinkage and stress, providing excellent high temperature resistance for curing systems, continuous working temperature up to 200 ℃.

LORD Thermoset SC-309导热型有机硅灌封胶是一种两组份体系，可满足电气/电子封装领域对高导热性的要求，同时又能保持有机硅的理想特性，可在室温下固化，也可高温固化以最大限度提高粘合力。

EP937 is a one-component epoxy resin designed specifically to meet the requirements of semiconductor device coatings on printed circuit boards and has excellent resistance to thermal shock and humidity.

LORD Thermoset EP-20环氧树脂是一种通用的双组份非填充型环氧树脂，旨在连同多种Thermoset固化剂一起使用，已获得各种处理和固化属性，可用于粘合剂、层压、和电气/电子绝缘。

NoCleanSolderPasteFeatures:-BroadPrintingProcessWindow         -Low-Tombstoning        -NoHead-in-Pillow-ClearPin–ProbeTestableResidue

TSF-WS917-1 is a water-soluble viscous flux. Post-reflow residues are completely soluble in water and can be rinsed off at temperatures as low as 40 ° C without the need to add cleaning additives.

Kester TSF ULR-18 is a no-clean ultra-low residual tack flux. To meet this market demand, Kester has developed an ultra-low resolution viscous flux with a reflow residue weight of less than 10%, which is reduced by 3 times compared with traditional rosin-based viscous flux, and the trace amount of residue is very reliable , Compatible with post-processing materials.

CT2700R7S is a low-temperature, pressure-free sintered silver paste based on nanotechnology with a thermal conductivity of up to 200W and excellent thermal conductivity.

CT2021E is a solvent-free silver glue with low moisture absorption and low stress, suitable for resin systems with low elastic modulus.

CT285LT is a high thermal conductivity silver paste that can be cured at a low temperature, suitable for the mounting of power ICs, transistors and high-power, high-brightness LEDs

XT2884 is an epoxy resin-based transparent insulating adhesive, suitable for bonding small chips such as LEDs.

CT227L is a non-solvent paste based on epoxy resin. The paste has high adhesive strength and is suitable for mounting small chips (such as LED chips).

CT2403 is based on our original new silicone polymer, which has excellent die-cutting strength and good LED heat resistance.

CT285 is a solvent-free silver glue with epoxy resin as the base material. CT285 has excellent electrical conductivity and thermal conductivity, and is suitable for the mounting of power module packages that must have high heat dissipation, and the use of high-power and high-brightness LEDs.

CT220HK-S1 is a solvent-free silver paste based on epoxy resin, suitable for dipping process. It is suitable for the mounting of LEDs with small chips and has excellent reliability.

Kester WP616 is a halogen-free, lead-free, water-soluble solder paste formulation suitable for nitrogen and air reflow applications.

NP560 is a no-clean solder paste with halogen-free, low residue, etc. Void is significantly improved when applied on PCB.

Kester NP545 is a zero halogen, lead-free, no-clean solder paste with a shelf life of 12 months at room temperature.

Kester EM808 It is a lead-free, organic acid, water-soluble solder paste, providing users with the highest level of consistency and performance. EM808 The activator of has superior wettability OSPl Coated and silver plated substrates.

Lord thermoset sc-320 is a two-component system designed to meet the requirements of high thermal conductivity in the field of electrical / electronic packaging, while maintaining the ideal properties of silicone.

LORD CoolThermTM SC-1500 Thermal conductive silicon gap filler is a two-component system, which provides good thermal conductivity for electronic applications.

PREFORMDIMENSIONALOFFERINGSKesterpreformsCanbeprocessedinawiderangePleaseviewthetablebelowforstandarddimensionalofferingsandtolerances.

Complete intermetallic bonding Very good metal tightness Excellent mechanical strength, ductility and high reliability Copper cladding makes the solid conductive and thermally better

LORD® 403E and 406E acrylic adhesives are used in conjunction with LORD curing agent 17, 19 or 19GB to replace welding, brazing, riveting and other mechanical fastening methods. These adhesives are particularly excellent in low temperature environments and high impact load applications.

Lord ® 320 / 322 is a two-component general-purpose epoxy adhesive specially used for bonding SMC of automobile molding plastics without surface treatment. For pretreated metal, rubber, glass fiber plastic (FRP), thermosetting polyester, thermoplastic polyester and other materials, the adhesive system has excellent adhesive properties.

LORD Chemlok ?? 459X primer is used to promote adhesion to thermoplastic elastomer (TPE), thermoplastic polyolefin (TPO) and EPDM rubber, and can be applied directly.