Shanghai Fairfield Electronic Technology Co., Ltd.





Products

Package material

Process design

Service

Seven industries

Packagematerials

Network

Ten years experience

Sales system

Culture

Remember & Struggle

Technical support

product display

PRODUCTS

Airtight package

About the application or characteristics of Mingfen materials in the industrial and engineering fields

Semiconductor packaging

About the application or characteristics of Mingfen materials in the industrial and engineering fields.

LED packaging and lighting

About the application or characteristics of Mingfen materials in the industrial and engineering fields

Electronics and assembly

About the application or characteristics of Mingfen materials in the industrial and engineering fields

Optical communications

About the application or characteristics of Mingfen materials in the industrial and engineering fields

Industry and Engineering

About the application or characteristics of Mingfen materials in the industrial and engineering fields.

Technical File

All kinds of materials provided by Fairfield welcome to refer to and download "Fairfield Brochure"

Recommended

Technical File

Thermoset SC-320LV（H）

LORD Thermoset SC-320LVH is a two-component system that not only provides the excellent thermal conductivity required for electronic / electrical packaging, but also retains the necessary silicon-related characteristics.

High-lead solder

NoCleanSolderPasteFeatures:-BroadPrintingProcessWindow -Low-Tombstoning -NoHead-in-Pillow-ClearPin–ProbeTestableResidue

Thermoset SC-320

LORD Thermoset SC-320 is a two-component system designed to meet the high thermal conductivity requirements in the electrical / electronic packaging field while maintaining the ideal characteristics of silicone.

Thermoset SC-315

LORD Thermoset SC-315 is a two-component system thermal conductive silicon encapsulant, designed to have excellent flame retardancy and exhibit low shrinkage and stress, providing excellent high temperature resistance for curing systems, continuous working temperature up to 200 ℃.

Thermoset SC-309

LORD Thermoset SC-309导热型有机硅灌封胶是一种两组份体系，可满足电气/电子封装领域对高导热性的要求，同时又能保持有机硅的理想特性，可在室温下固化，也可高温固化以最大限度提高粘合力。

Thermoset EP-937

EP937 is a one-component epoxy resin designed specifically to meet the requirements of semiconductor device coatings on printed circuit boards and has excellent resistance to thermal shock and humidity.

Thermoset EP-20

LORD Thermoset EP-20环氧树脂是一种通用的双组份非填充型环氧树脂，旨在连同多种Thermoset固化剂一起使用，已获得各种处理和固化属性，可用于粘合剂、层压、和电气/电子绝缘。

Thermoset EL-636

LORD Thermoset EL-636 is a two-component system specifically designed for high temperature applications and is recommended for the stator assembly of motors for downhole oil pumps.





product display

ABOUT US

We are sales of imported semiconductor packaging materials, to provide process design and solutions, strong technical support as a supplement to high-tech trading companies. Since its official establishment on February 12, 2004, Ming Endeavor has steadily grown into an international agency with sales growth rate of more than 50% per year. In Hong Kong, Shenzhen, Beijing, Nanjing, Chengdu, Changzhou and other places have set up branches and offices.

Chip binder, chip envelope glue, bond ingress with gold wire aluminum wire, solder, edge glue, LED potting material, power module, inverter, drive module and other special potting materials, thermal materials, circuit plate cavity, shell, abrasive material, hot sink, etc.

Learn More+

product display

NEWS

Company News Industry News Recruitment

China Semiconductor Technology International Conference

2021-03-10

PCIM Asia Conference 2020 to present the best of power electronics research and practice

2020-11-14

New dates of 10 – 13 October for Messe Frankfurt’s Guangzhou Light + Building fairs

Due to a more favourable date becoming available at the fairs’ venue, the organiser of Guangzhou International Lighting Exhibition (GILE) and Guangzhou Electrical Building Technology (GEBT) has announ

2020-09-29

SENSOR CHINA Expo & Conference 2020

SENSOR CHINA Expo & Conference 2020 Shanghai Convention & Exhibition Center of International Sourcing, China The global IoT market value is forecasted to increase to 1.7 trillion US$. This means that IoT will be the next global economic growth point. Sensor is in the perception layers of IoT and regarded as the foundation and prerequisite of realizing IoT technology. In recent years, the IoT application market has experienced a sharp increased. As a result, the demand for sensors is predicted to have a substantial growth from 10 billion levels to trillion levels by the year 2025. SENSOR CHINA is the first and only sensor oriented professional industry event in China including one expo, 10+ parallel conferences and a lot of industry social events. It focuses on sensor technology and sensor oriented application and system solutions. Nearly 200 sensor and IoT companies from Asia, North America and Europe present to meet and collaborate around themes such as stat-of-the-art technologies, R&D advances, the latest industry development trends and the opportunities & challenges facing the industry. SENSOR CHINA warmly invites you to join and participate in this exciting event. Date Sep. 23 -25, 2020 Venue Shanghai Convention & Exhibition Center of International Sourcing, China Organization Guided by Ministry of Industry and Information Technology of the PRC Science and Technology Commission of Shanghai Municipality Organized by Sensors and IoT Industry Association Shanghai Technology Convention & Exhibiton Co.,Ltd. Supported by National Intelligent Sensor Innovation Center

2020-09-14

product display

PARTNER

Customer satisfaction, perfect quality, help customers solve difficult problems





SALES NETWORK

Ming Fen Hong Kong Holdings Limited

ADD: Room 813, 8 / F, Dade Industrial Building, 2/12 Kwai Fat Road, Kwai Chung, New Territories, Hong Kong
FAX: +852-2428 1826
TEL: +852-2428 2816

Shanghai Mingfen Electronic Technology Co., Ltd.

ADD: B909, Yinhai Building, No. 250 Caoxi Road, Xuhui District, Shanghai
FAX: 021-5448 0017
TEL: 021-544 80018
Mobile：137 6417 3938

Shenzhen Mingfen Electronic Technology Co., Ltd.

ADD: Room 702, West Block, Building 201, Tairan Industrial Zone, Chegongmiao, Futian District, Shenzhen
FAX: 0755-8335 1758
TEL: 0755-8335 1658
Mobile：138 2877 1678

FAIRFIELD USA Inc.

ADD: Rm.16D, 1600 Broadway on The Square, 1600 Broadway, Manhattan, New York,NY10019, USA
Mobile: +1 7187175284

Beijing Fairfield Electronic Technology Co.,Ltd,

ADD: Rm.707, No.3 Maizidian West Road,Chaoyang District, Beijing, China
FAX: 010-6443 6253
TEL: 010-6443 6255
Mobile：158 0108 8992

Xi'an Mingfen Electronic Technology Co., Ltd.

ADD: Room 1106, Northwest Plaza, Xuhong Northwest Corner of Sixth Road of Fengcheng and Mingguang Road, Economic Development Zone, Xi
FAX: +86-29-8668 8900
TEL: +86-29-8668 8900
Mobile：180 9217 6643

Chengdu Mingfen Electronic Technology Co., Ltd.

ADD: Room 1219, Superstructure, No. 426 Shuhan Road, Chengdu
FAX: 028-6166 7430
TEL: 028-6166 7460
Mobile：138 8038 7383

Shanghai Fairfield Electronic Technology Co.,Ltd.

ADD: Rm.702, No.2 Building,Hengda Central Square, No.286, South Hongqiao Rd., Jiangyin, China.
FAX：+ 86-0510-86622900
TEL(Main)：+ 86-0510-86622800
Mobile：+86-138 1785 3216

Products

Service

Network

Culture

Airtight package

Semiconductor packaging

LED packaging and lighting

Electronics and assembly

Optical communications

Industry and Engineering

Technical File

China Semiconductor Technology International Conference

PCIM Asia Conference 2020 to present the best of power electronics research and practice

New dates of 10 – 13 October for Messe Frankfurt’s Guangzhou Light + Building fairs

SENSOR CHINA Expo & Conference 2020

上海铭奋电子科技有限公司