Stress-Free, Very High

Thermally Conductive

Reworkable

Epoxy Paste Adhesive

IDEAL FOR:

High Power Die Attach

Substrate and Component Attach

Reworkability

Mismatched CTE's

DESCRIPTION:

ME7156-M is a reworkable, boron nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components.

It can be readily reworked at 80-100?C with torque or peel stress.

AVAILABILITY:

ME7156-M is available in syringes for automatic needle dispense applications or in jars.

APPLICATION PROCEDURES:

( 1 ) Thaw for 30 minutes before opening jar.

( 2 ) Dispense adhesive onto clean substrate.

( 3 ) Cure according to one of the recommended schedules.

TYPICAL PROPERTIES*

CURE SCHEDULES:

Temperature         Time         Presure

80℃                  8hr

100℃                 4hr

125℃                 2hr

150℃                 1hr

SHELF LIFE:

Storage temperature            Shelf Life

-40℃                              1yr

Pot Life                           72 hrs@ 25℃