产品中心
NameCT220HK-S1
CategoryConductive Silver Paste
Summary
CT220HK-S1 is a solvent-free silver paste based on epoxy resin, suitable for dipping process. It is suitable for the mounting of LEDs with small chips and has excellent reliability.
Product description
CT220HK-S1 is a solvent-free silver paste based on epoxy resin, suitable for dipping process. It is suitable for the mounting of LEDs with small chips and has excellent reliability.
1.Introduction
Die Attach Paste CT220HK-S1 is a epoxy resin based and non solvent type paste. This paste is
effectively used for LED chip mounting because of its high adhesive strength.
2.Features
1) Good workability due to one liquid type.
2) High adhesive strength.
3) Bleedless during cure.
4) Low ionic impurity content, and high reliability.
Copyright @ Shanghai Mingfen Electronic Technology Co., Ltd 沪ICP备12022625号-1 Technical support: 300.CN Shanghai