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NameXT2884
CategoryInsulating silver paste material
Summary
XT2884 is an epoxy resin-based transparent insulating adhesive, suitable for bonding small chips such as LEDs.
Product description
XT2884 is an epoxy resin-based transparent insulating adhesive, suitable for bonding small chips such as LEDs.
Specialty:
1) One-component is easy to use and has good dispensing workability.
2) High bonding strength at high temperature and excellent reliability.
3) Good yellowing resistance.
General characteristics:
| Pilot projects | unit | Representative value | test methods | ||
| Uncured | Exterior | - | Milky white translucent gel | Visual | |
| proportion | - | 1.2 | - | ||
| Viscosity (25 ℃) | Step | 45 | BROOKFIELD viscometer, 0.5min -1 | ||
| Thixotropic index (25 ℃) | - | 5.0 | BROOKFIELD viscometer, 0.5min -1 / 5min -1 | ||
| Non-volatile matter | wt% | 93 | 180℃x2h | ||
| Uncured | Modulus of elasticity (25 ℃) | Mpa | 2000 | DMA | |
| Glass transition temperature | ℃ | 117 | |||
| Thermal expansion coefficient | A'1 | ppm/℃ | 93 | DARK | |
| A'2 | 180 | ||||
| Next strength (shear strength) | 25 ℃ | N | 8.0 | Chip: 0.3mm si Bracket: copper silver plated | |
| 200 ℃ | 1.8 | ||||
| Transmittance | % | 71 | Thickness 1.0mm, wavelength 400nm | ||
| hardness | - | 86 | Shore D | ||
Standard hardening conditions:
150 ℃ × 2.0 hours (oven)
Precautions:
It must be kept airtight in a cold and dark place (-30 ℃ ～ -15 ℃).
Please remove it from the refrigerator before use and return to normal temperature before use.
