CoolTherm® SC-3500 thermally conductive, low volatile silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

CoolTherm® UR-389 encapsulant is a two-component urethane system designed for encapsulating and casting applications. CoolTherm UR-389 encapsulant cures at room temperature to produce a flame retardant, semiflexible material.

CoolTherm® SC-324 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.

LORD CoolTherm® SC-305 thermally conductive silicone encapsulant is a two-component system designed for encapsulation applications. It is suited for a variety of electronics applications where high heat dissipation is required. CoolTherm SC-305 encapsulant can be either room temperature cured or heat cured for maximum adhesion.

Kester WP616 is a halogen-free, lead-free, water-soluble solder paste formulation suitable for nitrogen and air reflow applications.

NP560 is a no-clean solder paste with halogen-free, low residue, etc. Void is significantly improved when applied on PCB.

Kester NP545 is a zero halogen, lead-free, no-clean solder paste with a shelf life of 12 months at room temperature.