NoCleanSolderPasteFeatures:-BroadPrintingProcessWindow         -Low-Tombstoning        -NoHead-in-Pillow-ClearPin–ProbeTestableResidue

TSF-WS917-1 is a water-soluble viscous flux. Post-reflow residues are completely soluble in water and can be rinsed off at temperatures as low as 40 ° C without the need to add cleaning additives.

Kester TSF ULR-18 is a no-clean ultra-low residual tack flux. To meet this market demand, Kester has developed an ultra-low resolution viscous flux with a reflow residue weight of less than 10%, which is reduced by 3 times compared with traditional rosin-based viscous flux, and the trace amount of residue is very reliable , Compatible with post-processing materials.

CT2700R7S is a low-temperature, pressure-free sintered silver paste based on nanotechnology with a thermal conductivity of up to 200W and excellent thermal conductivity.

CT285LT is a high thermal conductivity silver paste that can be cured at a low temperature, suitable for the mounting of power ICs, transistors and high-power, high-brightness LEDs

CT285 is a solvent-free silver glue with epoxy resin as the base material. CT285 has excellent electrical conductivity and thermal conductivity, and is suitable for the mounting of power module packages that must have high heat dissipation, and the use of high-power and high-brightness LEDs.

Kester WP616 is a halogen-free, lead-free, water-soluble solder paste formulation suitable for nitrogen and air reflow applications.

NP560 is a no-clean solder paste with halogen-free, low residue, etc. Void is significantly improved when applied on PCB.