LORD Thermoset SC-320LVH is a two-component system that not only provides the excellent thermal conductivity required for electronic / electrical packaging, but also retains the necessary silicon-related characteristics.
LORD Thermoset SC-320LV(H) thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/ electronic encapsulating applications, while retaining desirable properties associated with silicones.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures. Durable – composed of an addition-curing polymer that will not depolymerize when heated in confined spaces. Low Viscosity – maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials. High Temperature Resistant – provides excellent resistance for cured system that experiences continuous operating temperature up to 200°C; provides excellent thermal shock resistance.
UL Rated – provides excellent flame retardancy; UL 94 V-0 certified.
Mixing – Thoroughly stir each component prior to mixing together. Mix Thermoset SC-320LV(H) resin with Thermoset SC-320LV(H) hardener at a 1:1 ratio, by weight or volume, until uniform in color. Automatic meter/mix/dispense equipment may be used for high volume production.
Unless a closed-chamber mechanical mixer is used, air will be introduced into the encapsulant system either during mixing or when catalyzing the mixture. Electrical properties of the silicone encapsulant are best when air bubbles and voids are minimized. Therefore, in extremely high voltage or other critical applications, vacuuming may be appropriate.
Applying – Apply silicone encapsulant using handheld cartridges or automatic meter/mix/dispense equipment.
Avoid applying Thermoset SC-320LV(H) encapsulant to surfaces that contain cure inhibiting ingredients, such as amines, sulfur or tin salts. If bonding surface is in question, apply a test patch of Thermoset SC-320LV(H) encapsulant to the surface and allow it to set for the normal cure time.
|Appearance||Pink Liquid||White Liquid||Light Pink Liquid|
|Gel Time, min @80℃||-||-||4-8|
|Working Life, min 250℃||-||-||30|
Typical Cured Properties*
Volume Resistivity, ohm-cm @25 ℃ 1X1014
Thermal Conductivity, W/mk 2.6
Hot Disc Transient Method
Coefficient of Linear Thermal
Expansion, ppm @25℃ 160
ASTM C 864
Shore A, ASTM D 2240
Tensile Strength, Mpa 0.69
ASTM D 412
Lap Shear Strength, Mpa 0.90
Elongation at Break,% 30
Moisture Absorption,% <0.1
Dielectric Strength, V/mil 400
1 MHZ, ASTM D 150
Dielectric Constant @25℃ 3.25
1 MHZ, ASTM D150
Dissipation Factor, %@25℃ <1
1 MHZ. ASTMD 150
Extractable lonic Contaminants, ppm
**Cure schedule of 2 hours @ 80°C. Data is typical and not to be used for specification purposes.
Curing – Allow encapsulant to cure for 30 minutes at 80°C, or for 24 hours at room temperature (25°C). This time-at-temperature profile refers to the time the material should be allowed to cure once it reaches the target temperature. Allowance should be made for oven ramp rates, parts with large thermal mass and other circumstances that may delay material reaching the target temperature.
Shelf life of each component is nine months from date of manufacture when stored at 25°C in original unopened container.
Thermoset SC-320LV(H) encapsulant evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.
Before using this or any LORD product, refer to the Safety Data Sheet (SDS) and label for safe use and handling instructions.
For industrial/commercial use only. Must be applied by trained personnel only. Not to be used in household applications. Not for consumer use.