LORD Thermoset SC-320LVH is a two-component system that not only provides the excellent thermal conductivity required for electronic / electrical packaging, but also retains the necessary silicon-related characteristics.

LORD Thermoset SC-320 is a two-component system designed to meet the high thermal conductivity requirements in the electrical / electronic packaging field while maintaining the ideal characteristics of silicone.

LORD Thermoset SC-315 is a two-component system thermal conductive silicon encapsulant, designed to have excellent flame retardancy and exhibit low shrinkage and stress, providing excellent high temperature resistance for curing systems, continuous working temperature up to 200 ℃.

LORD Thermoset SC-309导热型有机硅灌封胶是一种两组份体系，可满足电气/电子封装领域对高导热性的要求，同时又能保持有机硅的理想特性，可在室温下固化，也可高温固化以最大限度提高粘合力。

EP937 is a one-component epoxy resin designed specifically to meet the requirements of semiconductor device coatings on printed circuit boards and has excellent resistance to thermal shock and humidity.

LORD Thermoset EP-20环氧树脂是一种通用的双组份非填充型环氧树脂，旨在连同多种Thermoset固化剂一起使用，已获得各种处理和固化属性，可用于粘合剂、层压、和电气/电子绝缘。

LORD Thermoset EL-636 is a two-component system specifically designed for high temperature applications and is recommended for the stator assembly of motors for downhole oil pumps.

Stress-Free,VeryHighThermallyConductiveReworkableEpoxyPasteAdhesiveIDEALFOR:HighPowerDieAttachSubstrateandComponentAttachReworkabilityMismatchedCTE'sDESCRIPTION