Stress Free, Ultra High

Thermal Conductivity

Solvent Free

Reworkable

Epoxy Paste Adhesive

IDEAL FOR:

High Power Die Attach

Substrate and Component

Reworkable

Mismatched CTE's

DESCRIPTION:

ME7155-CD is a reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The ultra high thermal conductivity of this diamond filled material makes it useful for bonding high-powered, large area die and components.

It can be readily reworked from 80 to 100℃.

AVAILABILITY:

ME7155-CD is available in syringes for automatic needle dispense applications or in jars.

APPLICATION PROCEDURES:

( 1 ) Thaw for at least 30 minutes before using.

( 2 ) Dispense adhesive onto clean substrate.

( 3 ) Cure according to one of the recommended schedules.

TYPICAL PROPERTIES*

CURE SCHEDULES:

Temperature         Time         Presure

80ºC                  8hr

100ºC                 4hr

125ºC                 2hr

150ºC                 1hr

SHELF LIFE:

Storage temperature            Shelf Life

-40ºC