Stress Free, Ultra High
Epoxy Paste Adhesive
High Power Die Attach
Substrate and Component
ME7155-CD is a reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The ultra high thermal conductivity of this diamond filled material makes it useful for bonding high-powered, large area die and components.
It can be readily reworked from 80 to 100℃.
ME7155-CD is available in syringes for automatic needle dispense applications or in jars.
( 1 ) Thaw for at least 30 minutes before using.
( 2 ) Dispense adhesive onto clean substrate.
( 3 ) Cure according to one of the recommended schedules.
Temperature Time Presure
Storage temperature Shelf Life