Stress Free

Solvent Free

Thermally Conductive

Reworkable

Epoxy Paste Adhesive

IDEAL FOR:

High Power Die Attach  Substrate and Component Reworkability  Mismatched CTE'sDESCRIPTION:

ME7155 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits not only outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper), but also exhibits a high level of uniformity and consistency in appearance and smoothness of texture, yielding potential ease of use and success in applications. The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components.

AVAILABILITY:

ME7155 is available in syringes for automatic needle dispense applications or in jars.

APPLICATION PROCEDURES:

( 1 ) Remove from freezer in original sealed package.

( 2 ) Thaw for 30 to 60 minutes at 25?C before using.

( 3 ) Dispense adhesive onto clean substrate.

( 4 ) Cure according to one of the recommended cure schedules.

TYPICAL PROPERTIES*

CURE SCHEDULES:

Temperature         Time         Presure

80℃                  8hr

100℃                 4hr

125℃                 2hr

150℃                 1hr

SHELF LIFE:

Storage temperature           Shelf Life

-40℃                                        1yr

Pot Life                              5 Days @ 25℃