Epoxy Paste Adhesive
Large Area Die Substrate and Component Reworkability Mismatched CTE's
ME8456 is a reworkable, pure silver filled, electrically and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
It can be readily reworked from 80 to 100?C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Meets Mil-Std 883; Method 5011.5 and NASA-ESA Outgassing Requirements***
ME8456 is available in syringes for automatic needle dispense applications or in jars. Both viscosity and thixotropic index can be modified to your specific needs.
( 1 ) Thaw sealed at ambient for 30 minutes before using.
( 2 ) Dispense adhesive onto clean substrate.
( 3 ) Pre-bake dispensed adhesive at 80?C for 30 minutes to achieve optimum bonding. Pre-bake not needed in all applications.**
( 4 ) Cure according to one of the recommended cure schedules.
Temperature Time Presure
*125ºC 2 hr *Recommend
*150ºC 1hr using prebake
** For higher temperature curing, above 125ºC and/or bonding area of over 1x1sq cm, it is recommended the dispensed adhesive be prebaked, open-faced without parts, at 80ºC for 30 minutes before parts are mounted and cured.
Storage temperature Shelf Life
Pot Life 5 days @ 25ºC
*** 24 Hour 125ºC or 100ºC vacuum or air flow oven post bake required to meet outgassing requirements