Low CTELow Moisture Absorption

Low lonic Impurities

High Electrical Conductivity

High Thermal Conductivity

IDEAL FOR：

Chip or component adhesive

High temperature devices

High power devices

DESCRIPIION

MC8880 is a one part, silver-filled cyanate ester adhesive that iselectrically and thermally conductive. It is designed for use in both chipand com ponent level attach application to reduce stress. It can withstandtemperatures up to 300C without thermal degradation. Its uniquechemistry results in very low moisture absorption, high adhesive strength.

AVAILABILITY:

AMC8880 is available in syringes for automatic dispense applications

APPLICATION PROCEDURES:

(1 )Thaw to room temperature before opening container.

(2 )Dispense adhesive onto clean die or substrate.

(3 )Cure according to the recommended schedules.

NOTE: The monomer contained in this product is subject tocrystallization even at room temperature. If product is thawed andneeded to return product to the liquid state i.e. usually not more tfz Yoremains crystallized, simply place in 40℃ environment for as long15-20 minutes.

Die Attach MC8880

TYPICAL PROPERTIES*

URE SCHEDULES:

Temperature          Time           Pressure

125℃                   2hr

150℃                     45min

175℃                     10min

Pot life is 5 days @25℃

1cP=10-3Pas=1mPa·s;145psi=.99974MPa=.99974N'mm2;

1b=4.448N; 1 inch=25.4 mm; 1V/mil=393701 V/mm; 1 b-in s0.11298N-m

shelf life

storage temperature               shelf life

-40℃                               1yr