High Moisture Resistance
Epoxy Film Adhesive
High Volume, Automated Assemblies
Wafer Level Die-Attach
ESP8660-HK is a silver filled high-bond strength epoxy film adhesive. It can be used in die-cut preform for ease
of pick-and-placement. This new generation film can also be incorporated with wafer dicing tape and packaged together into one DDAF (Dicing Die Attach Film).
It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP8660-HK has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.
ESP8660-HK is available in sheet sizes or rolls. Standard thickness of ESP8660-HK are 15 microns and 30 microns. Special thicknesses are available.
( 1 ) Keep product in aluminum polylaminate protective bag when not in use.
( 2 ) Before using, remove protective release liner from film. Place wafer onto adhesive film.
( 3 ) Laminate (low heat) wafer onto adhesive film until good wetting is achieved.
( 4 ) Cure according to one of the recommended schedules.
Temperature Time Pressure
125ºC 1 hr 8-10 psi
150ºC 30 min 8-10 psi
The die or component can also be tacked on the substrate at 80ºC or higher with 10 psi. When a fillet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.
Storage temperature Shelf Life
0-5ºC 1 yr in sealed package