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NameFlux material

CategoryFlux
Summary
Product description
Adhesive flux liquid flux

 

product Viscous flux         Liquid flux  
Product number TSF6522RH TSF6592LV TSF-6592HF TSF-ULR18 TSF-WS917 LX6-93-11 LX6-93-M1
Types of No cleaning (can also be cleaned with 5768 cleaning agent) No-clean No-clean No-clean Wash No-clean No-clean
use Printing / Immersion Printing / Immersion Printing / Immersion Printing / Immersion Printing / Immersion injection injection
Halogen classification Halogen-free Halogen Halogen-free Halogen-free Halogen-free Zero halogen Zero halogen
viscosity 90 100 100 140-160 160 - -
Viscosity 221 235 240 350-550 212 solids 10% solids 5%
acid 78 85 103 20-50 53 40 35
Halide content ~750ppm ~750ppm ~750ppm ~750ppm ~750ppm 0 0
TI value 0.78 0.8 0.28 5-7 0.69 - -
Expiration date 12mths 12mths 12mths 12mths 12mths 12mths 12mths
Storage conditions 0-10 ℃ 0-10 ℃ 0-10 ℃ 0-30℃(RT) 10-30℃(RT) 10-25 ℃ 10-25 ℃
Advantage Applicable to a wide range of copper OSP solder reflow Active and stable flux Halogen-free, good solderability, high viscosity value and long viscosity life can be reflowed at a maximum temperature of 270 ℃ Good weldability, good wettability, no solvent diffusion, ultra-low residue Good wettability, weldability and welding performance Low soil content and low viscosity, easy to spray without causing preform displacement Low solid content and low viscosity, easy to spray without causing preform displacement
Practical application FCOF, FCOL, COB, high-lead solder gold-tin (Au80sn20) high-temperature solder solder FCGA, SIP, FCCSP, module FCLGA, SIP, FCCSP and PCB / BGA ball rework, gold germanium (Au / 12Ge) high temperature solder solder FCOL, FCQFN, FCCSP, 3D, 2.5D package FCBGA.FCCSP, POP, COB, FCSIP, value ball Indium sheet welding Indium sheet welding

 

实际应用:


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