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Product description
| Adhesive flux | liquid flux |
 |
 |
| product | Viscous flux | Liquid flux | |||||
| Product number | TSF6522RH | TSF6592LV | TSF-6592HF | TSF-ULR18 | TSF-WS917 | LX6-93-11 | LX6-93-M1 |
| Types of | No cleaning (can also be cleaned with 5768 cleaning agent) | No-clean | No-clean | No-clean | Wash | No-clean | No-clean |
| use | Printing / Immersion | Printing / Immersion | Printing / Immersion | Printing / Immersion | Printing / Immersion | injection | injection |
| Halogen classification | Halogen-free | Halogen | Halogen-free | Halogen-free | Halogen-free | Zero halogen | Zero halogen |
| viscosity | 90 | 100 | 100 | 140-160 | 160 | - | - |
| Viscosity | 221 | 235 | 240 | 350-550 | 212 | solids 10% | solids 5% |
| acid | 78 | 85 | 103 | 20-50 | 53 | 40 | 35 |
| Halide content | ～750ppm | ～750ppm | ～750ppm | ～750ppm | ～750ppm | 0 | 0 |
| TI value | 0.78 | 0.8 | 0.28 | 5-7 | 0.69 | - | - |
| Expiration date | 12mths | 12mths | 12mths | 12mths | 12mths | 12mths | 12mths |
| Storage conditions | 0-10 ℃ | 0-10 ℃ | 0-10 ℃ | 0-30℃(RT) | 10-30℃(RT) | 10-25 ℃ | 10-25 ℃ |
| Advantage | Applicable to a wide range of copper OSP solder reflow | Active and stable flux | Halogen-free, good solderability, high viscosity value and long viscosity life can be reflowed at a maximum temperature of 270 ℃ | Good weldability, good wettability, no solvent diffusion, ultra-low residue | Good wettability, weldability and welding performance | Low soil content and low viscosity, easy to spray without causing preform displacement | Low solid content and low viscosity, easy to spray without causing preform displacement |
| Practical application | FCOF, FCOL, COB, high-lead solder gold-tin (Au80sn20) high-temperature solder solder | FCGA, SIP, FCCSP, module | FCLGA, SIP, FCCSP and PCB / BGA ball rework, gold germanium (Au / 12Ge) high temperature solder solder | FCOL, FCQFN, FCCSP, 3D, 2.5D package | FCBGA.FCCSP, POP, COB, FCSIP, value ball | Indium sheet welding | Indium sheet welding |
实际应用：
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