产品中心
Product description
Product series (divided by shape)
Standard rectangular size (mm): 30x10, 20x10, 10x10
Various customized sizes (mm): 42x19, 32x24, 24x17, 24x24, etc.
Rectangular size | Custom size |
Comparison of thermal conductivity with competitor products
Excellent thermal conductivity
The coefficient of thermal expansion is 7.8ppm / k at 800 ℃
Measure all samples under the same conditions
Competitor product A | Competitor product B | Competitor product C | Competitor product D | SBS-40 | CNG-50 | |
status | Published | Published | Published | Published | Published | Published |
structure | Cu CuMo CuMo = 66.7% | Cu CuMo CuMo = 33.3% | Cu CuMo CuMo = 20% | Cu CuMo CuMo = 13.3% | Cu TSG structure Cu special design | Cu copper-graphite Cu special design |
Thermal diffusion coefficient (mm² / s) | 66.1 | 80.9 | 87.6 | 89.5 | 107 | 193 |
Specific heat (j / g / k) | 0.30 | 0.34 | 0.36 | 0.37 | 0.38 | 0.42 |
Density (g / cmm³) | 9.40 | 9.02 | 9.00 | 9.02 | 9.01 | 5.78 |
Coefficient of thermal expansion (ppm / k, RT ~ 800 ℃) | 8.52 | 11.2 | 12.2 | 11.4 | 8.11 | 8.34 |
Thermal conductivity (W / m · k) | 188 | 251 | 286 | 299 | 362 | 476 |
Copyright @ Shanghai Mingfen Electronic Technology Co., Ltd 沪ICP备12022625号-1 Technical support: 300.CN Shanghai