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Stress-Free,VeryHighThermallyConductiveReworkableEpoxyPasteAdhesiveIDEALFOR:HighPowerDieAttachSubstrateandComponentAttachReworkabilityMismatchedCTE'sDESCRIPTION
StressFreeSolventFreeThermallyConductiveReworkableEpoxyPasteAdhesiveDEALFOR: HighPowerDieAttach SubstrateandComponent Reworkability MismatchedCTE'SDESCRIPTION
StressFree,UltraHighThermalConductivitySolventFreeReworkableEpoxyPasteAdhesiveIDEALFOR:HighPowerDieAttachSubstrateandComponentReworkableMismatchedCTE'sDESCRIPTION
StressFreeSolventFreeThermallyConductiveReworkableEpoxyPasteAdhesiveIDEALFOR:HighPowerDieAttach SubstrateandComponentReworkability MismatchedCTE'sDESCRIPTION
FlexibleEpoxyAdhesiveSolventFreePasteToughandReworkableAmbientTemperatureStorableIDEALFOR:LargeAreaBondingMismatchedCTEBondingSubstrateAttachDESCRIPTION:ME7150isatoughandyetflexibleepoxyadhesive.
LOWCTELowMoistureAbsorptionLowlonicImpurities(<5ppmCl,Na+,K+)HighTemperatureStabilityIDEALFOR:ChiporComponentBondingDESCRIPTION