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Stress-Free,VeryHighThermallyConductiveReworkableEpoxyPasteAdhesiveIDEALFOR:HighPowerDieAttachSubstrateandComponentAttachReworkabilityMismatchedCTE'sDESCRIPTION

ME7156-M

StressFreeSolventFreeThermallyConductiveReworkableEpoxyPasteAdhesiveDEALFOR: HighPowerDieAttach SubstrateandComponent Reworkability MismatchedCTE'SDESCRIPTION

ME7155-M

StressFree,UltraHighThermalConductivitySolventFreeReworkableEpoxyPasteAdhesiveIDEALFOR:HighPowerDieAttachSubstrateandComponentReworkableMismatchedCTE'sDESCRIPTION

ME7155-CD

StressFreeSolventFreeThermallyConductiveReworkableEpoxyPasteAdhesiveIDEALFOR:HighPowerDieAttach SubstrateandComponentReworkability MismatchedCTE'sDESCRIPTION

ME7155

FlexibleEpoxyAdhesiveSolventFreePasteToughandReworkableAmbientTemperatureStorableIDEALFOR:LargeAreaBondingMismatchedCTEBondingSubstrateAttachDESCRIPTION:ME7150isatoughandyetflexibleepoxyadhesive.

ME7150

LOWCTELowMoistureAbsorptionLowlonicImpurities(<5ppmCl,Na+,K+)HighTemperatureStabilityIDEALFOR:ChiporComponentBondingDESCRIPTION

MC7883

jams_shen@fairfield.com.cn

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Shanghai Fairfield Electronic Technology Co.,Ltd.

Add： Rm.708，BLK.B，Yinhai Building，No.250，CaoxiRd., Xuhui District, Shanghai,200235，China

TEL：0086-21-5448 0018

FAX：086-21-54480017