Stress-Free,VeryHighThermallyConductiveReworkableEpoxyPasteAdhesiveIDEALFOR:HighPowerDieAttachSubstrateandComponentAttachReworkabilityMismatchedCTE'sDESCRIPTION

StressFreeSolventFreeThermallyConductiveReworkableEpoxyPasteAdhesiveDEALFOR: HighPowerDieAttach SubstrateandComponent Reworkability MismatchedCTE'SDESCRIPTION

StressFree,UltraHighThermalConductivitySolventFreeReworkableEpoxyPasteAdhesiveIDEALFOR:HighPowerDieAttachSubstrateandComponentReworkableMismatchedCTE'sDESCRIPTION

StressFreeSolventFreeThermallyConductiveReworkableEpoxyPasteAdhesiveIDEALFOR:HighPowerDieAttach SubstrateandComponentReworkability MismatchedCTE'sDESCRIPTION

FlexibleEpoxyAdhesiveSolventFreePasteToughandReworkableAmbientTemperatureStorableIDEALFOR:LargeAreaBondingMismatchedCTEBondingSubstrateAttachDESCRIPTION:ME7150isatoughandyetflexibleepoxyadhesive.

LOWCTELowMoistureAbsorptionLowlonicImpurities(<5ppmCl,Na+,K+)HighTemperatureStabilityIDEALFOR:ChiporComponentBondingDESCRIPTION

FlexibleStressFreeLowTemperatureCurableElectricallyConductiveEpoxyPasteAdhesiveIDEALFORLargeAreaDieSubstrateandComponentReworkabilityMismatchedCTE'SDESCRIPIION

StressFreeReworkableElectricallyConductiveEpoxyPasteAdhesiveIDEALFOR:LargeAreaDieSubstrateandComponentReworkabilityMismatchedCTE'sDESCRIPTION:ME8456isareworkable,puresilverfilled,electricallyandthermallyconductiveepoxypasteadhesive