产品中心
NameCT2021E
CategorySilver paste material
Summary
CT2021E is a solvent-free silver glue with low moisture absorption and low stress, suitable for resin systems with low elastic modulus.
Product description
Introduction:
CT2021E is a solvent-free silver glue with low moisture absorption and low stress, suitable for resin systems with low elastic modulus.
Specialty:
1) The syringe dispensing workability is good. 2) Long touch drying time. 3) Can be applied to large chips. 4) Low modulus of elasticity.
General characteristics:
Standard curing conditions:
Oven curing: keep the temperature up to 150 ° C for 30min and keep it for 120min
Precautions:
Store in a freezer at -30 ° C to -15 ° C in a sealed state.
Please use it within 24h after returning to normal temperature.
