CT2021E is a solvent-free silver glue with low moisture absorption and low stress, suitable for resin systems with low elastic modulus.
1) The syringe dispensing workability is good. 2) Long touch drying time. 3) Can be applied to large chips. 4) Low modulus of elasticity.
Standard curing conditions:
Oven curing: keep the temperature up to 150 ° C for 30min and keep it for 120min
Store in a freezer at -30 ° C to -15 ° C in a sealed state.
Please use it within 24h after returning to normal temperature.