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NameCT2021E

CategorySilver paste material
Summary
CT2021E is a solvent-free silver glue with low moisture absorption and low stress, suitable for resin systems with low elastic modulus.
Product description

Introduction:

CT2021E is a solvent-free silver glue with low moisture absorption and low stress, suitable for resin systems with low elastic modulus.

Specialty:

1) The syringe dispensing workability is good. 2) Long touch drying time. 3) Can be applied to large chips. 4) Low modulus of elasticity. 

General characteristics:

Standard curing conditions:

Oven curing: keep the temperature up to 150 ° C for 30min and keep it for 120min

Precautions:

Store in a freezer at -30 ° C to -15 ° C in a sealed state.

Please use it within 24h after returning to normal temperature.