CoolTherm® SC-3500 thermally conductive, low volatile silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

CoolTherm® UR-389 encapsulant is a two-component urethane system designed for encapsulating and casting applications. CoolTherm UR-389 encapsulant cures at room temperature to produce a flame retardant, semiflexible material.

CoolTherm® SC-324 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.

LORD CoolTherm® SC-305 thermally conductive silicone encapsulant is a two-component system designed for encapsulation applications. It is suited for a variety of electronics applications where high heat dissipation is required. CoolTherm SC-305 encapsulant can be either room temperature cured or heat cured for maximum adhesion.

Lord thermoset sc-320 is a two-component system designed to meet the requirements of high thermal conductivity in the field of electrical / electronic packaging, while maintaining the ideal properties of silicone.

LORD CoolThermTM SC-1500 Thermal conductive silicon gap filler is a two-component system, which provides good thermal conductivity for electronic applications.

describe LORD ThermosetTM GF-1400 Thermal conductive silicon gap filler is a two-component system, which is used to provide good thermal conductivity for electronic applications.