CT2700R7S is a low-temperature, pressure-free sintered silver paste based on nanotechnology with a thermal conductivity of up to 200W and excellent thermal conductivity.

CT285LT is a high thermal conductivity silver paste that can be cured at a low temperature, suitable for the mounting of power ICs, transistors and high-power, high-brightness LEDs

CT285 is a solvent-free silver glue with epoxy resin as the base material. CT285 has excellent electrical conductivity and thermal conductivity, and is suitable for the mounting of power module packages that must have high heat dissipation, and the use of high-power and high-brightness LEDs.