Welcome to Shanghai Fairfield Electronic Technology Co., Ltd.

Products

产品中心

产品中心

相关文件

There is currently no content to display
Please add data record on website background.

NameEMC

CategoryMolding Compound
Summary
TechnicalRoadmapPackagedesignimageandrequirementtothemoldingcompoundsCurrentlineupProductsline-up-PowermoduleDevelopmentofhighthermalresistivityEMCHighTgforhighthermalresistivity
Product description

Technical Roadmap

Package design image and requirement to the molding compounds

Current lineup

Products line-up -Power module

Development of high thermal resistivity EMC

High Tg for high thermal resistivity, and fitting the CTE of EMC for that of substrate is treated.

High thermal resistivity EMC for power module

General property of high thermal resistivity grade

Associated enterprise:Shanghai Fairfield Electronic Technology Co.,Ltd.
Copyright @ Shanghai Mingfen Electronic Technology Co., Ltd 沪ICP备12022625号-1 Technical support: 300.CN Shanghai