产品中心
NameCT227L
CategoryInsulating Silver Paste
Summary
CT227L is a non-solvent paste based on epoxy resin. The paste has high adhesive strength and is suitable for mounting small chips (such as LED chips).
Product description
CT227L is a non-solvent paste based on epoxy resin. The paste has high adhesive strength and is suitable for mounting small chips (such as LED chips).
1.Introduction
Die Attach Paste CT227L is a epoxy resin based and non solvent type paste.
This paste is effectively used for small chip (ex.LED chip) mounting because of its high adhesive strength.
2.Features
1) Good workability due to one liquid type.
2) Good electrical conductivity
3) Good adhesion strength to several lead flames.
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