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NameME7155-M

CategoryInsulating glue
Summary
StressFreeSolventFreeThermallyConductiveReworkableEpoxyPasteAdhesiveDEALFOR: HighPowerDieAttach SubstrateandComponent Reworkability MismatchedCTE'SDESCRIPTION
Product description

Stress Free

Solvent FreeThermally Conductive

Reworkable

Epoxy Paste Adhesive

DEAL FOR: High Power Die Attach   Substrate and Component  Reworka bility  Mismatched CTE'S

DESCRIPTION:

ME7155-M is a flexible, alumina filled, electrically insulating andthermally conductive epoxy paste adhesive which exhibits outstandingflexibility for bonding materials having highly mismatched CTES(I.ealumina to aluminum, silicon to copper). The high thermal conductivityof this material makes it useful for bonding high-powered, large areadie and components.

It can be readily reworked at 80-100℃.

AVAILABILITY:

ME7155-M is available in syringes for automatic needle dispenseapplications or in jars.

APPLICATION PROCEDURES:

(1) Remove from freezer in original sealed package.

(2) Thaw for 30 to 60 minutes at 25'C before using.

(3) Dispense adhesive onto clean substrate.

(4) Cure according to one of the recommended cure schedules.

TYPICAL PROPERTIES*

CURE SCHEDULES:

Temperature         Time         Presure

80ºC                  8-16hr

100ºC                 4-8hr

125ºC                 2-4hr

150ºC                 1-2hr

175ºC                 10-20min

Pot life is 5 days at 25ºC.

SHELF LIFE:

Storage temperature            Shelf Life

-40ºC                              1yr


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