Low Temperature Curable
Epoxy Paste Adhesive
Large Area Die
Substrate and Component
AME8456-DA is a flexible, pure silver filled, electrically and thermallyconductive epoxy paste adhesive for die-attach application. It exhibitsoutstanding flexibility for bonding materials with highly mismatchedCTES(e, alumina to aluminum, silicon to copper) It has been provento work well for ultra-large area die on ceramic, copper or aluminumsubstrate.
Die attach with a large area on aluminum have been proven towithstand thermal cycling and shocks from-65 to 150C for over 1000times without loss of thermal or mechanical properties. Moisturesensitivity has been improved even for the worst testing conditions. Thebond strength recovers its full bond strength after the testing is finishedand moisture returns to normal level
ME8456-DA is available in syringes for automatic neede dispenseapplications or in jars.
(1) Thaw for 30 minutes before opening jar.
(2) Dispense adhesive onto clean substrate.
(3) pre-bake Dispensed Adhesive at 60C for 30 minutes to achieveoptimum bonding Pre-bake is not needed in all applications.
(4) Cure according to one of the recommended schedules
Temperature Time Presure
potLife 5 days @ 25ºC
** For higher temperature curing above 125ºC, and/or bonding area of over 1x1 sq cm, it is recommended the dispensed adhesive be pre-baked, open-faced without parts, at 60ºC for 30 minutes before parts are mounted and cured.
Storage temperature Shelf Life