Tacky-Free Epoxy Film
Not Measurable Electrical Conduct
-55℃ Tg : Flexible "Stress-Free"
Large Area Die Attach
Mismatched CTE Substrate Attach
Thermal Ground Plane Bonding
Wafer Lamination and Stack-chip Bonding
ESP8450-SC is a fast curing, high melt-flow version of standard ESP8450 with ultra-high thermal conductivity and low thermal resistance. It is designed for large area bonding and wafer-level lamination for stack-chip applications. It is a solvent resistant, silver-filled, flexible epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This novel, B-staged non-electrically conductive adhesive offers excellent flexibility from -55-150ºC.
ESP8450-SC has excellent thermal conductivity and its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.
ESP8450-SC is available in sheet sizes or as custom preforms. Standard thicknesses are 0.003" and 0.006". Special thicknesses are available.
( 1 ) Let product stay at room temperature for 15 minutes. Remove film from protective paper.
( 2 ) Cut to desired size.
( 3 ) Place on substrate and cure according to one of the recommended schedules.
Temperature Time Pressure
80℃ 120min 10psi
120℃ 30min 8psi
150℃ 5min 5psi
The die or component can also be tacked on the substrate at 100℃ or higher with nominal placement pressure. When a fillet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.
Storage temperature Shelf Life
in sealed container